VSWA2-63DR+ PCN Report

Due to obsolescence of the dice used in Current part (Current Fab), a new set of dice in a nearly identical package (Future Fab/Replacement Fab) has been qualified and has replaced the current part. Performance of Part with Replacement Die set has been judged by Mini-Circuits Engineering as a close alternative to current part_a

MECHANICAL DIMENSIONS & PCB LAND PATTERN

CONCLUSION:

2) PERFORMANCE COMPARISON, TYPICAL AT VDD=+5V at 25°C_a

3) PERFORMANCE COMPARISON, TYPICAL AT VDD=+3V at 25°C_a

4) PERFORMANCE COMPARISON CURVES_a, CURRENT FAB vs. FUTURE FAB: VDD=+5V

5) PERFORMANCE COMPARISON CURVES_a, CURRENT FAB vs. FUTURE FAB: VDD=+3V