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Recent Publications
Application Notes
A Practical Approach to the Design and Implementation of Scalable, High-Performance, Custom SMT Packages for mmWave Applications

All Application Notes
Product Literature New Product Guide – Q3 2020

December 24, 2020
Mini-Circuits Awarded Patent for Low-Cost mmWave Integrated LTCC Packaging Technology
The new packaging technology, which supports both wire bonding and flip-chip assembly methods, gives chipmakers and system designers an option to build millimeter-wave systems at production volume without compromising on electrical performance or cost. Official Release ›

November 6, 2020
Mini-Circuits Opens New Warehouse and Shipping Hub in Penang
Expansion of Malaysia facility will allow Mini-Circuits to offer many customers shorter lead times and lower freight costs. Official Release ›

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