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ECCN# EAR99
Material Declaration
AN0-42 - A guide to surface mount assembly
AN00-007 - Handling of Mini-Circuits Open Case Models
AN03-36 - Measurement methods
AN40-004 - Reflow Soldering of Lead-less LTCC Products
AN40-005 - Prevention and Control of Electrostatic Discharge ESD)
AN40-014 - Surface Mount Assembly of Mini-Circuits Components
D4-D041 - Tape & Reel Packaging For Surface Mount Devices
DG02-23A - Understanding Surface Mount
DG02-32 - Statistical process control
For detailed questions regarding the performance characteristics and limitations of this product in your intended application, please click Contact Us and we will respond promptly.
PCN25-032 * 05/02/2025 * Transition to alternate qualified ceramic substrate materia
AN40-012 - dBm - volts - watts conversion table
DG03-111 - Return loss vs. VSWR table
SPEC1-2 - Insertion Loss Uncertainty Due to Mismatch Calculator
Hi-Rel
Space Upscreening
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2 Ways Power Splitter, 10 - 1000 MHz, 50Ω
BIAS TEE / SMA / BKT / RoHS
LTCC Low Pass Filter, DC - 2800 MHz, 50Ω
Connectorized SMA, High Power, Linear Amplifier, 5900 MHz to 18 GHz, 50Ω
2 Ways Power Splitter, 0.1 - 400 MHz, 50Ω
20 dB SMT Directional Coupler, 100 - 1200 MHz, 50Ω
LTCC 90° Hybrid, 1100 - 1925 MHz, 50Ω
SMT MMIC, Medium Power, Linear, pHEMT Amplifier, DC to 6000 MHz, 50Ω, Ceramic, 3x3 mm Package
PWR DIV / SMA RoHS5
