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ECCN# EAR99
Material Declaration
AN0-42 - A guide to surface mount assembly
AN00-007 - Handling of Mini-Circuits Open Case Models
AN03-36 - Measurement methods
AN40-004 - Reflow Soldering of Lead-less LTCC Products
AN40-005 - Prevention and Control of Electrostatic Discharge ESD)
AN40-014 - Surface Mount Assembly of Mini-Circuits Components
COUP7-2 - Introduction, definition of terms, Q&As
D4-D041 - Tape & Reel Packaging For Surface Mount Devices
DG02-23A - Understanding Surface Mount
DG02-32 - Statistical process control
For detailed questions regarding the performance characteristics and limitations of this product in your intended application, please click Contact Us and we will respond promptly.
PCN05-013 * 10/12/2005 * LTCC substrate color
PCN23-059 * 08/21/2023 * Change to Terminal Pad Plating material
AN40-012 - dBm - volts - watts conversion table
DG03-111 - Return loss vs. VSWR table
SPEC1-2 - Insertion Loss Uncertainty Due to Mismatch Calculator
Hi-Rel
Space Upscreening
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Connectorized BNC, Medium Power, Linear Amplifier, 0.0025 MHz to 700 MHz, 50Ω
Level 7, Double Balanced Mixer, RF/LO Freq 3700 - 10000 MHz
Reflectionless Band Pass Filter, 17500 - 18500 MHz, 50Ω
Hand-Flex Interconnect, 0.086" center diameter, 18.0 GHz, 8.0″
TB,A1843+,KU1513,50 OHM
TB,XLF-132H+,DG1847,50 OHM
2 Ways Core & Wire Power Splitter, 5 - 1500 MHz, 75Ω
1:1.5 CORE & WIRE Transformer, 0.3 - 225 MHz, 50Ω
Hand-Flex Interconnect, 0.086" center diameter, 18.0 GHz, 9.0″
