0
Hello. Sign in
Your Account
ECCN# EAR99
Material Declaration
AN0-42 - A guide to surface mount assembly
AN00-007 - Handling of Mini-Circuits Open Case Models
AN03-36 - Measurement methods
AN40-004 - Reflow Soldering of Lead-less LTCC Products
AN40-005 - Prevention and Control of Electrostatic Discharge ESD)
AN40-014 - Surface Mount Assembly of Mini-Circuits Components
D4-D041 - Tape & Reel Packaging For Surface Mount Devices
DG02-23A - Understanding Surface Mount
DG02-32 - Statistical process control
For detailed questions regarding the performance characteristics and limitations of this product in your intended application, please click Contact Us and we will respond promptly.
PCN10-022-1 * 07/22/2011 * Addition of flat "lid" to top side of the core
PCN23-059 * 08/21/2023 * Change to Terminal Pad Plating material
AN40-012 - dBm - volts - watts conversion table
DG03-111 - Return loss vs. VSWR table
SPEC1-2 - Insertion Loss Uncertainty Due to Mismatch Calculator
Hi-Rel
Space Upscreening
International Shipping Option >
Please contact us for availability.
Flexible Interconnect, 0.047" center diameter, 40 GHz
Hand-Flex Interconnect, 0.086" center diameter, 18.0 GHz
3 Ways Power Splitter, 1 - 1000 MHz, 75Ω
Hand-Flex Interconnect, 0.141" center diameter, 18.0 GHz
USB 75Ω Power Sensor 100 kHz - 2.5 GHz, -30 to +20 dBm
KIT FXD SS ATTEN / SMA / RoHS
2 Ways Core & Wire Power Splitter, 5 - 1200 MHz, 75Ω
Ceramic Resonator Band Pass Filter, 1525 - 1585 MHz, 50Ω
