ECCN# EAR99

Material Declaration

AN0-42 - A guide to surface mount assembly

AN00-007 - Handling of Mini-Circuits Open Case Models

AN03-36 - Measurement methods

AN40-004 - Reflow Soldering of Lead-less LTCC Products

AN40-005 - Prevention and Control of Electrostatic Discharge ESD)

AN40-014 - Surface Mount Assembly of Mini-Circuits Components

COUP7-2 - Introduction, definition of terms, Q&As

D4-D041 - Tape & Reel Packaging For Surface Mount Devices

DG02-23A - Understanding Surface Mount

DG02-32 - Statistical process control

For detailed questions regarding the performance characteristics and limitations of this product in your intended application, please click Contact Us and we will respond promptly.

PCN05-013 * 10/12/2005 * LTCC substrate color

PCN23-059 * 08/21/2023 * Change to Terminal Pad Plating material

AN40-012 - dBm - volts - watts conversion table

DG03-111 - Return loss vs. VSWR table

SPEC1-2 - Insertion Loss Uncertainty Due to Mismatch Calculator

Hi-Rel

Space Upscreening