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ECCN# EAR99
Material Declaration
AN0-42 - A guide to surface mount assembly
AN00-007 - Handling of Mini-Circuits Open Case Models
AN03-36 - Measurement methods
AN40-004 - Reflow Soldering of Lead-less LTCC Products
AN40-005 - Prevention and Control of Electrostatic Discharge ESD)
AN40-014 - Surface Mount Assembly of Mini-Circuits Components
D4-D041 - Tape & Reel Packaging For Surface Mount Devices
DG02-23A - Understanding Surface Mount
DG02-32 - Statistical process control
For detailed questions regarding the performance characteristics and limitations of this product in your intended application, please click Contact Us and we will respond promptly.
PCN10-022-1 * 07/22/2011 * Addition of flat "lid" to top side of the core
PCN23-059 * 08/21/2023 * Change to Terminal Pad Plating material
PCN24-047 * 07/26/2024 * Spec Change
PCN25-032 * 05/02/2025 * Transition to alternate qualified ceramic substrate materia
AN40-012 - dBm - volts - watts conversion table
DG03-111 - Return loss vs. VSWR table
SPEC1-2 - Insertion Loss Uncertainty Due to Mismatch Calculator
Hi-Rel
Space Upscreening
International Shipping Option >
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