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ECCN# EAR99
Material Declaration
AN0-42 - A guide to surface mount assembly
AN00-007 - Handling of Mini-Circuits Open Case Models
AN03-36 - Measurement methods
AN10-002 - Miniature power splitters
AN10-006 - Understanding Power Splitters
AN40-004 - Reflow Soldering of Lead-less LTCC Products
AN40-005 - Prevention and Control of Electrostatic Discharge ESD)
AN40-014 - Surface Mount Assembly of Mini-Circuits Components
D4-D041 - Tape & Reel Packaging For Surface Mount Devices
DG02-23A - Understanding Surface Mount
DG02-32 - Statistical process control
PWR2-4 - Frequently asked questions
For detailed questions regarding the performance characteristics and limitations of this product in your intended application, please click Contact Us and we will respond promptly.
PCN23-059 * 08/21/2023 * Change to Terminal Pad Plating material
AN40-012 - dBm - volts - watts conversion table
DG03-111 - Return loss vs. VSWR table
SPEC1-2 - Insertion Loss Uncertainty Due to Mismatch Calculator
Hi-Rel
Space Upscreening
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2 Ways Core & Wire Power Splitter, 1000 - 2500 MHz, 50Ω
Level 13, SMT Triple Balanced Mixer, RF/LO Freq 500 - 3500 MHz
1:16 CORE & WIRE Transformer, 20 - 300 MHz, 50Ω
1:25 CORE & WIRE Transformer, 0.02 - 30 MHz, 50Ω
LTCC Low Pass Filter, DC - 16500 MHz, 50Ω
3 Ways Core & Wire Power Splitter, 1 - 300 MHz, 50Ω
Lumped LC Low Pass Filter, DC - 22 MHz, 50Ω
LTCC Low Pass Filter, DC - 575 MHz, 50Ω
Lumped LC High Pass Filter, 225 - 3000 MHz
